surface mount rf schottky diodes in sot-323 (sc-70) technical data features ? surface mount sot-323 package ? low turn-on voltage (as low as 0.34 v at 1 ma) ? low fit (failure in time) rate* ? six-sigma quality level ? single and dual versions ? tape and reel options available * for more information see the surface mount schottky reliability data sheet. package lead code identification (top view) description/applications these schottky diodes are specifi- cally designed for analog and digital applications requiring devices in sot-323 surface mount packages. this series offers a wide range of specifications and package configurations to give the designer wide flexibility. typical applications of these schottky diodes are mixing, detecting, switching, sampling, clamping, and wave shaping. common
cathode f common
anode e series c single b hsms-280a series hsms-281a series hsms-282a series absolute maximum ratings, t c = 25oc symbol parameter unit absolute maximum [1] i f forward current (1 m s pulse) amp 1 p iv peak inverse voltage v same as v br t j junction temperature c 150 t stg storage temperature c -65 to 150 q jc thermal resistance [2] c/w 150 notes: 1. operation in excess of any one of these conditions may result in permanent damage to the device. 2. t c = +25 c, where t c is defined to be the temperature at the pack- age pins where contact is made to the circuit board.
2 electrical specifications, t c = +25 c, single diode [1] minimum maximum maximum maximum typical part package breakdown forward forward reverse maximum dynamic number marking lead voltage voltage voltage leakage capacitance resistance hsms- code [2] code configuration v br (v) v f (mv) v f (v) @ i r (na) @ c t (pf) r d ( w ) i f (ma) v r (v) 280b a0 b single 70 400 1.0 15 200 50 2.0 35 280c a2 c series 280e a3 e common anode 280f a4 f common cathode 281b b0 b single 20 400 1.0 35 200 15 1.2 15 281c b2 c series 281e b3 e common anode 281f b4 f common cathode 282b c0 b single 15 340 0.7 30 100 1 1.0 12 282c c2 c series 282e c3 e common anode 282f c4 f common cathode test conditions i r = 10 m ai f = 1 ma [3] v f = 0 v i f = 5 ma f = 1 mhz [4] notes: 1. effective carrier lifetime ( t ) for all these diodes is 100 ps maximum measured with krakauer method at 5 ma, except hsms-282x which is measured at 20 ma. 2. package marking code is laser marked. 3. d v f for diodes in pairs is 15.0 mv maximum at 1.0 ma. 4. d c to for diodes in pairs is 0.2 pf maximum. typical performance, t c = 25 c (unless otherwise noted), single diode figure 2. forward current vs. forward voltage at temperatures? hsms-281a series. 0 0.1 0.3 0.2 0.5 0.6 0.4 0.8 0.7 0.9 i f ?forward current (ma) v f ?forward voltage (v) figure 1. forward current vs. forward voltage at temperatures? hsms-280a series. 0.01 10 1 0.1 100 t a = +125 c
t a = +75 c
t a = +25 c
t a = ?5 c
0 0.1 0.3 0.2 0.5 0.6 0.4 0.8 0.7 i f ?forward current (ma) v f ?forward voltage (v) 0.01 10 1 0.1 100 t a = +125 c
t a = +75 c
t a = +25 c
t a = ?5 c
figure 3. forward current vs. forward voltage at temperatures? hsms-282a series. 0 0.10 0.20 0.30 0.50 0.40 i f ?forward current (ma) v f ?forward voltage (v) 0.01 10 1 0.1 100 t a = +125 c
t a = +75 c
t a = +25 c
t a = ?5 c
3 typical performance, t c = 25 c (unless otherwise noted), single diode, continued figure 4. reverse current vs. reverse voltage at temperatures? hsms-280a series. 0102030 50 40 i r ?reverse current (na) v r ?reverse voltage (v) 1 1000 100 10 100,000 10,000 t a = +125 c
t a = +75 c
t a = +25 c
figure 5. reverse current vs. reverse voltage at temperatures? hsms-281a series. 05 15 i r ?reverse current (na) v r ?reverse voltage (v) 10 1 1000 100 10 100,000 10,000 t a = +125 c
t a = +75 c
t a = +25 c
figure 6. reverse current vs. reverse voltage at temperatures? hsms-282a series. 05 15 i r ?reverse current (na) v r ?reverse voltage (v) 10 1 1000 100 10 100,000 10,000 t a = +125 c
t a = +75 c
t a = +25 c
figure 7. dynamic resistance vs. forward current. 0.1 1 100 r d ?dynamic resistance ( ) i f ?forward current (ma) 10 1 10 1000 100 hsms-2800 series
hsms-2810 series
hsms-2820 series
figure 8. total capacitance vs. reverse voltage?sms-280a series. 0102030 50 40 c t ?capacitance (pf) v r ?reverse voltage (v) 0 1.5 1 0.5 2 figure 9. total capacitance vs. reverse voltage?sms-281a series. 02 6 41012 816 14 c t ?capacitance (pf) v r ?reverse voltage (v) 0 0.75 0.50 0.25 1.25 1 figure 10. total capacitance vs. reverse voltage?sms-282a series. 02 8 6 c t ?capacitance (pf) v r ?reverse voltage (v) 4 0 0.6 0.4 0.2 1 0.8
4 assembly instructions sot-323 pcb footprint a recommended pcb pad layout for the miniature sot-323 (sc-70) package is shown in figure 11 (dimensions are in inches). this layout provides ample allowance for package placement by auto- mated assembly equipment without adding parasitics that could impair the performance. 0.026 0.035 0.07 0.016 figure 11. pcb pad layout (dimensions in inches). smt assembly reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g., ir or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. components with a low mass, such as the sot-323 package, will reach solder reflow temperatures faster than those with a greater mass. hps sot-323 diodes have been qualified to the time-temperature profile shown in figure 12. this profile is representative of an ir reflow type of surface mount assembly process. after ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste) passes through one or more preheat zones. the preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporat- ing solvents from the solder paste. the reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder. the rates of change of tempera- ture for the ramp-up and cool- down zones are chosen to be low enough to not cause deformation of the board or damage to compo- nents due to thermal shock. the maximum temperature in the reflow zone (t max ) should not exceed 235 c. these parameters are typical for a surface mount assembly process for hp sot-323 diodes. as a general guideline, the circuit board and components should be exposed only to the minimum temperatures and times necessary to achieve a uniform reflow of solder. time (seconds) t max temperature ( c) 0 0 50 100 150 200 250 60 preheat
zone cool down
zone reflow
zone 120 180 240 300 figure 12. surface mount assembly profile.
5 outline sot-323 (sc-70 3 lead) package dimensions part number ordering information part number no. of devices container hsms-28xa-tr1* 3000 7" reel hsms-28xa-blk* 100 antistatic bag * where x = 0, 1, or 2; a = b, c, e, or f 2.20 (0.087)
2.00 (0.079) 1.35 (0.053)
1.15 (0.045) 1.30 (0.051)
ref. 0.650 bsc (0.025) 2.20 (0.087)
1.80 (0.071) 0.10 (0.004)
0.00 (0.00) 0.25 (0.010)
0.15 (0.006) 1.00 (0.039)
0.80 (0.031) 0.20 (0.008)
0.10 (0.004) 0.30 (0.012)
0.10 (0.004) 0.30 ref. 10 0.425 (0.017)
typ. dimensions are in millimeters (inches)
tape dimensions and product orientation for outline sot-323 (sc-70 3 lead) p p 0 p 2 f w c d 1 d e a 0 8 max. t 1 (carrier tape thickness) t t (cover tape thickness) 5 max. b 0 k 0 description symbol size (mm) size (inches) length width depth pitch bottom hole diameter a 0 b 0 k 0 p d 1 2.24 0.10 2.34 0.10 1.22 0.10 4.00 0.10 1.00 + 0.25 0.088 0.004 0.092 0.004 0.048 0.004 0.157 0.004 0.039 + 0.010 cavity diameter pitch position d p 0 e 1.55 0.05 4.00 0.10 1.75 0.10 0.061 0.002 0.157 0.004 0.069 0.004 perforation width thickness w t 1 8.00 0.30 0.255 0.013 0.315 0.012 0.010 0.0005 carrier tape cavity to perforation
(width direction) cavity to perforation
(length direction) f p 2 3.50 0.05 2.00 0.05 0.138 0.002 0.079 0.002 distance width tape thickness c t t 5.4 0.10 0.062 0.001 0.205 0.004 0.0025 0.00004 cover tape www.hp.com/go/rf for technical assistance or the location of your nearest hewlett-packard sales office, distributor or representative call: americas/canada: 1-800-235-0312 or 408-654-8675 far east/australasia: call your local hp sales office. japan: (81 3) 3335-8152 europe: call your local hp sales office. data subject to change. copyright ? 1998 hewlett-packard co. obsoletes 5965-4705e printed in u.s.a. 5966-4901e (3/98)
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